Nordic Semiconductor recently announced the release of a Wafer-Level Chip Scale Package (WLCSP) version of its nRF7002 Wi-Fi 6 Companion IC. This new packaging option maintains the full functionality of the nRF7002 QFN variant while achieving a footprint reduction of over 60%, making the WLCSP version particularly well-suited for compact, space-sensitive designs in next-generation wireless devices.
The nRF7002 WLCSP is equipped with advanced Wi-Fi 6 features such as OFDMA and Target Wake Time (TWT), offering robust and efficient wireless connectivity. The IC is optimised for ultra-low power consumption, which contributes to extended battery life in connected devices. Its reduced size makes it an ideal solution for applications where space is at a premium, including modules, wearable technology, and portable medical devices.
The nRF7002 Wi-Fi 6 companion IC integrates seamlessly with Nordic’s award-winning nRF91 Series Systems in Package (SiPs), nRF52 and nRF53 Series multiprotocol Systems-on-Chip (SoCs), and the forthcoming nRF54L and nRF54H Series SoCs. This integration enables developers to fully leverage the benefits of Wi-Fi 6—including higher data rates, increased capacity, and enhanced power efficiency—alongside Nordic’s LTE-M/NB-IoT and Bluetooth LE solutions, thereby simplifying development and speeding up time-to-market.
“We are excited to offer the nRF7002 in a WLCSP package. Adding the package to the nRF7002 family provides our customers with a versatile and compact solution that meets the growing demands for smaller, more power-efficient IoT devices,” said Joakim Ferm, SVP Wi-Fi BU, Nordic Semiconductor. “This new option underscores our commitment to Wi-Fi and to delivering innovative connectivity solutions that enable our customers to push the boundaries of what’s possible in wireless design.”
The WLCSP version of the nRF7002 (nRF7002 CEAA) is now in full-scale production and available through distributors.
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