Soracom is pleased to announce the commercial launch of its integrated SIM (iSIM) technology alongside an iSIM-compatible cellular module built off of the Murata Type 1SC. This latest offering marks Soracom’s third SIM format, with the connectivity solution also offering card-type SIMs and chip-type eSIMs.
The commercial launch of iSIM technologies has been in the works since July 2021 and has been brought about thanks to key partnerships with IoT chipset developer Sony Semiconductor Israel, iSIM module manufacturer Murata, and iSIM Security solutions provider Kigen. Kigen’s Secure iSIM Operating System provides robust secure authentication services ensuring reliable out-of-the-box connectivity for commercial iSIM applications.
iSIM technology integrates the functions of the communication module and SIM into a single chip (System-on-Chip, SoC). This enables IoT device manufacturers to create more compact, lightweight and more power-efficient devices, as fewer physical components are required.
Designing connected devices with a singel, integrated solution for the communication module and the SIM has advantages such as reducing procurement, logistics, and storage costs. It also contributes to reduced environmental impact throughout the device manufacturing and sales lifecycle.
“We would like to express our gratitude to our partners for this exciting collaboration. Through this innovative model, iSIM seamlessly connects the LPWA chipset to the Soracom network, simplifying the hardware design and onboarding experience for our customers,” stated Dima Feldman, VP of Product Management and Marketing, Sony Semiconductor Israel. “This approach is essential for driving the adoption of lower-power cellular IoT applications and we believe it will significantly enhance IoT device-makers engagement and satisfaction.”
The Type 1SC module from Murata Manufacturing comes pre-installed with Soracom’s plan01s subscription, which enables users to seamlessly connect to cellular networks worldwide. By utilising Soracom’s subscription container feature, these modules can access other Soracom data plans, such as the optimised for LPWAN planX3. Regardless of their selected plan, users will also gain access to Soracom’s suite of connectivity tools that cover everything from data and device security to remote provisioning services and Cloud integration.
“As an ultra-compact, low-power iSIM-compatible cellular LPWA communication module, our Type 1SC module is a perfect fit for Soracom users,” said Hirokazu Nakae, General Manager, Connectivity Module Product Department, Communication Module Business Unit, Murata Manufacturing. “Combining our miniaturisation technology with iSIM provides users with a quick and easy solution for deploying IoT services at scale.”
“Thanks to our longstanding partnership with Soracom and our ecosystem partners, IoT device manufacturers now have instant access to our iSIM solution, accelerating developers’ speed to market and enhancing their ability to leverage global connectivity,” added Vincent Korstanje, CEO of Kigen. “This is a major milestone in supporting manufacturers with iSIM commercial general availability, globally.”
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