Data centres currently account for over 2% of global energy consumption. With the rise of AI, this figure is projected to increase to approximately 7% by 2030, equalling the current energy usage of India. Achieving efficient power conversion from grid to core is essential for enhancing power densities, which in turn improves computing performance and lowers the total cost of ownership (TCO).
In response, Infineon Technologies has introduced its TDM2354xD and TDM2354xT dual-phase power modules, which deliver top-tier power density for high-performance AI data centres. These modules provide true vertical power delivery (VPD) and lead the market with a current density of 1.6 A/mm², building on the earlier release of the TDM2254xD modules.
“We are proud to enable high-performance AI data centers with our TDM2354xT and TDM2354xD VPD modules. These devices will maximise system performance with Infineon’s trademark quality and robustness, thereby enabling best TCO for data centres,” said Rakesh Renganathan, Vice President Power ICs at Infineon Technologies. “Our industry-leading power devices and packaging technologies, combined with our extensive systems expertise, will further advance high-performance and green computing as part of our mission to drive digitalisation and decarbonisation.”
The TDM2354xD and TDM2354xT modules combine Infineon’s durable OptiMOS 6 trench technology, a chip-embedded package that enhances power density through improved electrical and thermal performance, and a new inductor technology enabling a lower profile for true vertical power delivery. These innovations set a new benchmark for power density and reliability, maximising the efficiency and performance of AI data centres.
The TDM2354xT modules support up to 160 A and are the first in the industry to feature Trans-Inductor Voltage Regulator (TLVR) technology in a compact 8 x 8 mm² form factor. Paired with Infineon’s XDP controllers, they offer rapid transient response and reduce on-board output capacitance by up to 50 percent, further increasing system power density.
These new modules will be featured at Infineon’s global technology event, OktoberTech 2024, in Silicon Valley on 17th October, and at electronica in Munich from 12-14 November.
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