Compex Systems has announced a new connector design for Multi-Link Operation (MLO).
This breakthrough enables seamless deployment of MLO across off-the-shelf platforms, including those with Intel x86 and ARM processors (e.g. NXP and Marvell), eliminating the need for custom-made host boards and unlocking the full potential of Wi-Fi 7 features for a wider range of users and applications.
Multi-Link Operation (MLO) is a key performance advantage of Wi-Fi 7 (802.11be), setting it apart by allowing the routing and aggregation of throughput across multiple radio links in different frequency bands. It enables data to be routed through the least congested links, improving overall latency and reliability. MLO can also aggregate bandwidths from more than one wireless link, enhancing throughput and network performance. It is ideal for bandwidth-intensive and real-time applications such as 4K/8K video streaming, cloud gaming, VR/AR, cloud computing and more. The latest generation phones, such as iPhone 16 and Pixel 9, already support MLO and automatically pick the best band to connect to a Wi-Fi 7 AP.
Implementing MLO typically requires custom host board designs with impedance-controlled traces to route high-speed signals between radios through card edge gold fingers, which pose challenges for 3rd party host boards as most do not support the interconnecting traces. Compex’s latest advancement features miniature interconnects and proprietary-configured connecting cables that enable high-speed MLO/WSI signals routing across multiple radios. The MLO/WSI signals are single-ended synchronous data streams, which require great care when routed, even on impedance-controlled PCBs. The Compex’s patent-pending signal conditioning design ensures optimal data transfer while minimising EMI. With Compex’s MLO Interconnect, the incredible speed and efficiency of Wi-Fi 7 with MLO are accessible across different CPU platforms, including those with Intel x86 and ARM processors, delivering lightning-fast connectivity and high-performance Wi-Fi 7 for both dynamic enterprise and industrial settings.
“We’re unlocking the future of wireless connectivity by making Wi-Fi 7’s most advanced features accessible on standard platforms,” said Jonathan Ho, Operations Manager of Compex Systems Pte. Ltd. “Our connector design on the Wi-Fi 7 modules is a game-changer, allowing the enterprise to experience the incredible speed, capacity and uninterrupted communication of Wi-Fi 7— without the limitations of custom host boards.”
Since 2014, Compex has been a Qualcomm Authorised Design Centre (ADC), reinforcing its commitment providing cutting-edge solutions that elevate industry standards. Whether you are looking for Tri-Band or Quad-Band Solutions, Compex’s MLO-enabled Wi-Fi 7 modules are designed to ensure enhanced network performance and provide future-proof connectivity. By eliminating the need for custom boards, Compex opens up a world of possibilities for enterprises with this cost-effective Wi-Fi 7 solution, making it affordable to deploy MLO features in diverse applications across a wide variety of platforms.
Building on the Compex’s Wi-Fi 7 modules, the standard miniPCIe form factor WLE7002E25 (Wi-Fi 7 802.11be 2X2 MU-MIMO 2.4GHz+5GHz Dual-Band Concurrent Module) and WLE7000E6 (Wi-Fi 7 802.11be 2X2 MU-MIMO 6GHz Module), deliver MLO-enhanced performance with improved latency and reliability. This Tri-Band Bundle Solution, supporting 2.4GHz, 5GHz and 6GHz, is a game-changing combination that offers low-latency and high-reliability, making it ideal for bandwidth-intensive and high-demand applicants. Additionally, the Compex standard miniPCIe form factor WLE7002E26 and WLE7002E55 deliver a powerful Quad-Band Bundle Solution with MLO capabilities, further expanding Compex’s product lineup of high-performance Wi-Fi 7 wireless solutions.
