SECO has announced it will participate at Embedded World China 2024, an exhibition for embedded systems technologies, taking place from 12-14 June at the Shanghai World Expo Exhibition and Convention Centre.
As a provider of end-to-end technological solutions, SECO is committed to fostering innovation and excellence in the digitalisation of industrial products and processes. This year, SECO will exhibit its latest collaborations and advanced products.
At SECO’s booth, visitors can explore SECO’s newest Computer-on-Module solutions, featuring next-generation processor technologies across x86 and Arm architectures, such as the SOM-SMARC-Genio700. This sophisticated SMARC module, developed in strategic partnership with MediaTek, leverages the powerful Genio family of System-on-Chips (SoCs) to deliver exceptional performance, energy efficiency, and extensive connectivity options suited for various IoT applications.
Additional high-performance Computer-on-Modules will also be showcased, such as the COM Express SOM-COMe-BT6-RPL-P, equipped with 13th Gen Intel Core processors (Raptor Lake U/P/H series) and Intel Processor U300E. Additionally, SECO will present modules with their own small form factor, particularly suitable for handheld devices, such as the SOM-Trizeps-VIII-MX8M-Plus and SOM-Myon-II-MX8M-Mini.
Single-board computers (SBCs) will also be on display, including the SBC-3.5-RK3568. This 3.5” form-factor Single Board Computer features the Rockchip RK3568 processor, optimised for lightweight AI and IoT applications. It offers robust connectivity, multiple display support, and extensive peripheral interfaces for enhanced functionality and accelerated development.
In addition to its advanced modules and SBCs, SECO will present a range of fanless embedded computers ideal for IIoT applications. Featured products include the Titan 300 TGL-UP3 AI, an edge AI solution leveraging the power of the 11th Gen Intel Core and Celeron SoCs integrated with Axelera AI’s Metis AIPU, delivering up to 120 TOPS.
To demonstrate the capabilities of AI in combination with fanless PC power, SECO will present an AI-based demo using the Palladio 500 RPL, which can detect people, recognise objects, and perform analyses in real time.
Another key component of SECO’s exhibition is the scalable Modular Vision HMI family. These new off-the-shelf solutions, based on x86 and Arm architectures, feature screen sizes ranging from 7 to 15 inches and up to 4K resolution. This versatile platform allows for application-specific customisations, enabling users to tailor processor performance to meet evolving demands.
Visitors to the company booth will also be introduced to Clea and StudioX, essential elements of SECO’s IoT and AI solutions portfolio. Clea, an open-source, modular software suite natively integrated into all SECO hardware, streamlines IoT implementations by enabling real-time management, analytics, and predictive maintenance.
It facilitates secure remote software updates and the deployment of intelligent applications. Built on generative AI, StudioX offers businesses a means to enhance operational efficiency, improve customer satisfaction, and deploy innovative revenue-generating services through their own AI-powered support services.
At the SECO booth, various application demos will showcase Clea and StudioX in action, highlighting the power and simplicity of data orchestration and AI across diverse use cases.
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