KAGA FEI has introduced the “WKI611AA1,” a new wireless LAN and Bluetooth combo module designed for embedded devices, featuring support for Wi-Fi 6 and Bluetooth.
This module is equipped with an integrated high-performance antenna and has received various certifications, streamlining the process of antenna development and certification for developers of industrial IoT and home automation devices, such as smart building systems, logistics handheld terminals, surveillance cameras, and home appliances. By utilising this module, companies can accelerate their product development and achieve quicker time-to-market.
With support for Wi-Fi 6 and Bluetooth, the WKI611AA1 is well-suited for applications demanding high data rates and robust interference management. The module is scheduled for mass production starting in May 2025. KAGA FEI remains committed to addressing market demands and expanding its range of modules.
Key product features:
- NXP chip integration: The module incorporates the “IW611” chip from NXP Semiconductors, featuring dedicated processors and memory for both the wireless LAN and Bluetooth subsystems, enabling independent real-time protocol processing. It supports Wi-Fi 6 and operates in both the 2.4GHz and 5GHz bands, delivering higher throughput, improved network efficiency, reduced latency, and a broader communication range compared to previous models
- Low power consumption: The module employs SDIO 3.0 for Wireless LAN and UART for Bluetooth as host interfaces, ensuring minimal power consumption. It also includes an efficient power management system with support for deep sleep low power mode, making it ideal for applications requiring extended operational periods
- Pre-certified with integrated antenna: The module features a built-in wideband, high-efficiency antenna, eliminating the need for separate antenna design. It has already obtained Bluetooth qualification and certifications under Japan’s Radio Law (MIC), the FCC (USA), and ISED (Canada), reducing development time and associated costs
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