IBASE Technology Inc. announces a collaboration with Qualcomm Technologies, Inc. for the upcoming embedded world 2024.
This event, scheduled for April 9-11, 2024, will be an opportunity to experience the latest in Edge AI solutions at the IBASE booth 3-351 in Hall 3, aimed at enhancing IoT devices.
During the exhibition, IBASE will introduce its newest innovations, including the RM-QCS6490-S SOM module equipped with the Qualcomm QCS6490 processor, and the RM-QCS610 SMARC 2.1 module featuring the Qualcomm QCS610 processor. Both modules are engineered to operate across a broad temperature range, from as low as -25°C to as high as +80°C, making them perfect for demanding environments. These advanced solutions offer robust connectivity and computing capabilities, tailored for industrial IoT applications across various sectors, including rugged handhelds and tablets, kiosks, point-of-sale systems, and human-machine interfaces.
“Collaborating with IBASE, we are excited to showcase next-generation Edge AI solutions powered by Qualcomm Technologies at Embedded World 2024,” stated Dev Singh, Vice President, Business Development and Head of Building, Enterprise & Industrial Automation, Qualcomm Technologies, Inc. “Our collaboration aims to deliver advanced computing capabilities for industrial IoT applications, enabling businesses to harness the power of AI in rugged environments.”
“IBASE has established a long-term collaboration with Qualcomm Technologies, working together to develop more advanced capabilities for customers in the field of Edge AI deployments,” said Albert Lee, President of IBASE. “We aim to deliver increasingly sophisticated and efficient AI-focused modules that empower businesses and industries worldwide. Through our ongoing collaboration, we are dedicated to shaping the Edge computing landscape and ushering in a new era of possibilities and beyond.”
