Ceva has maintained its position in the wireless connectivity IP market, according to IPNest’s latest Design IP Report. In 2023, Ceva commanded a significant 67% share of IP revenues, reinforcing its leadership in the sector.
The Ceva-Waves wireless connectivity IP portfolio includes some of the most widely adopted standards-based IPs, such as Bluetooth, Wi-Fi, UWB, and 802.15.4, available either individually or as part of the Ceva-Waves-Links multi-standard solutions. These IPs not only provide high-performance, reliable, and low-power connectivity but also play a crucial role in the company’s expansion into other IoT applications that demand advanced Edge AI processing and sensing capabilities.
Ceva’s involvement in wireless connectivity IP began over a decade ago, starting with Bluetooth and gradually encompassing Wi-Fi, 802.15.4, and more recently, UWB. As the IoT has proliferated, connecting virtually every electronic device, the demand for integrating wireless connectivity into MCU and SoC designs has surged.
The shortage of wireless design expertise, coupled with stringent cost, power, and time-to-market requirements, has driven significant demand for Ceva’s wireless connectivity IPs. As a result, in 2023 alone, over 1.3 billion devices worldwide featured Ceva’s wireless connectivity IP. Specifically, Ceva estimates it held a 35% share of the global Bluetooth IoT market and a 45% share of the TWS earbuds market, excluding Apple. For Wi-Fi 6, Ceva, with more than 40 licensees to date, anticipates capturing 25-30% of the Wi-Fi IoT market within the next two years.
Furthermore, the company has recently begun licensing its next-generation Ceva-Waves Bluetooth Channel Sounding, Wi-Fi 7, UWB 2.0, and 802.15.4 IPs, which are expected to further bolster Ceva’s market share.
“For many years, Ceva has been the dominant supplier of wireless interface IP to the semiconductor industry, with a strong focus on low power innovation and constantly being first to market with the latest standards,” said Dr. Eric Esteve, Principal Analyst at IPnest. “As the IP vendor with the broadest range of wireless connectivity IPs in an increasingly connected world, their portfolio provides proven solutions for the integration of multi-standard wireless connectivity into chip designs, faster and with lower risk.”
“Wireless connectivity is a fundamental building block of every smart Edge device and forms the basis of our strategy at Ceva to enable any device to connect, sense and infer data more reliably and efficiently,” added Iri Trashanski, Chief Strategy Officer at Ceva. “IPNest’s latest Design IP Report reinforces our incredible track record of successful implementations of wireless connectivity that powers billions of devices, established through partnerships with many of the world’s leading semiconductor companies and OEMs.
“Our customers rely on our proven and reliable IP to provide secure and high performance connectivity today and in future generations of their products. As the devices we connect become increasingly intelligent, our portfolio of sensing IPs and Edge AI NPUs perfectly complement our wireless IPs, and offer our customers a single source and unified approach for their smart edge product roadmaps.”
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