Analog Devices, the US-based semiconductor manufacturer, has unveiled a new suite of design tools aimed at simplifying and accelerating the development of increasingly complex power systems. The company’s latest offering, ADI Power Studio, brings together a group of products that…
Infineon and NVIDIA target greener AI growth with 800V direct current power systems
Infineon Technologies has unveiled a new 800-volt direct current (VDC) power architecture designed to improve efficiency and serviceability in artificial intelligence data centres, as the German chipmaker deepens its collaboration with NVIDIA. The move supports NVIDIA’s push, announced at Computex…
Plume backs RDK push to standardise connected home software
Plume, a US-based smart home connectivity company, has joined RDK Management as a Preferred Plus Member to help develop and enhance the open-source broadband platform RDK-B through software contributions and technical collaboration. Under the agreement, Plume will contribute software code,…
Renesas backs NVIDIA’s high-voltage AI infrastructure with efficient GaN power systems
Renesas Electronics is providing its gallium nitride (GaN) power conversion technology to support NVIDIA’s new 800 Volt Direct Current (DC) power architecture, a system set to underpin the next generation of high-performance AI data centres. The Japanese semiconductor company said…
Microchip targets AI data centres with next-generation PCIe 6.0 interconnects
Microchip Technology has launched a new generation of high-speed semiconductor switches aimed at easing data bottlenecks in artificial intelligence and high-performance computing systems, as demand for faster interconnects continues to surge. The US-based chipmaker said its Switchtec Gen 6 PCIe…
Quintauris and Andes join forces to accelerate global RISC-V adoption
Quintauris, the RISC-V ecosystem company backed by major semiconductor groups including Bosch, Infineon, NXP, and Qualcomm, has entered a strategic partnership with Taiwan’s Andes Technology, a leading supplier of RISC-V processor cores, in a move aimed at accelerating global adoption…
InterDigital and ABI Research identify 3GPP Release 20 as key bridge between 5G and 6G
A report from InterDigital and ABI Research has identified the latest 3GPP standards milestone, Release 20, as a critical bridge between 5G-Advanced and the future 6G era, marking a major step in the evolution of mobile connectivity. The study, The…
MediaTek and Airoha unveil AI fibre gateway to boost telecom network efficiency by 30%
MediaTek and its subsidiary Airoha Technology have unveiled what they describe as the world’s first AI-powered fibre gateway platform, in a move aimed at helping telecom operators improve network performance by more than 30%. The new platform will be displayed…
G+D integrates new eSIM standard into Amazon’s eero Signal
Giesecke+Devrient (G+D), the German SecurityTech company, has become one of the first firms to commercially deploy the SGP.32 eSIM standard, integrating the technology into Amazon’s eero Signal device. The move marks a notable step in the development of next-generation connected…
Semtech and Skylo launch world’s first single-vendor cellular–satellite IoT platform
Semtech Corporation has announced what it describes as the industry’s first “device-to-cloud” Internet of Things (IoT) platform offering both terrestrial and satellite connectivity through a single vendor, in partnership with Skylo Technologies. The California-based semiconductor and IoT group said on…
