Quintauris, the RISC-V ecosystem company backed by major semiconductor groups including Bosch, Infineon, NXP, and Qualcomm, has entered a strategic partnership with Taiwan’s Andes Technology, a leading supplier of RISC-V processor cores, in a move aimed at accelerating global adoption…
InterDigital and ABI Research identify 3GPP Release 20 as key bridge between 5G and 6G
A report from InterDigital and ABI Research has identified the latest 3GPP standards milestone, Release 20, as a critical bridge between 5G-Advanced and the future 6G era, marking a major step in the evolution of mobile connectivity. The study, The…
MediaTek and Airoha unveil AI fibre gateway to boost telecom network efficiency by 30%
MediaTek and its subsidiary Airoha Technology have unveiled what they describe as the world’s first AI-powered fibre gateway platform, in a move aimed at helping telecom operators improve network performance by more than 30%. The new platform will be displayed…
G+D integrates new eSIM standard into Amazon’s eero Signal
Giesecke+Devrient (G+D), the German SecurityTech company, has become one of the first firms to commercially deploy the SGP.32 eSIM standard, integrating the technology into Amazon’s eero Signal device. The move marks a notable step in the development of next-generation connected…
Semtech and Skylo launch world’s first single-vendor cellular–satellite IoT platform
Semtech Corporation has announced what it describes as the industry’s first “device-to-cloud” Internet of Things (IoT) platform offering both terrestrial and satellite connectivity through a single vendor, in partnership with Skylo Technologies. The California-based semiconductor and IoT group said on…
SECO launches Clea Vend platform to bring real-time data to vending operators
Italian technology group SECO has launched a telemetry platform, aiming to bring real-time data insights to a wider range of vending operators and streamline machine management. The Cloud-first Clea Vend platform offers operators monitoring and analytics tools for vending machines,…
Digi International surpasses 25 million XBee module shipments amid IoT expansion
Digi International, a US-based Internet of Things (IoT) connectivity provider, has announced that it has shipped more than 25 million of its XBee wireless modules, underscoring the widespread adoption of its technology across industries from space exploration to smart cities.…
Anritsu launches 5G satellite test cases to speed device certification
Anritsu Corporation has broadened its 5G testing portfolio with the launch of new test cases designed for non-terrestrial network (NTN) devices, accelerating certification for satellite-connected 5G equipment. The Japanese test and measurement company has added 3GPP-compliant wireless test cases to…
Rutronik expands SoC portfolio with Nordic Semiconductor’s latest low-power chip
Rutronik Elektronische Bauelemente has expanded its system-on-chip (SoC) portfolio with Nordic Semiconductor’s newest low power chip. The nRF54LM20A, part of the company’s nRF54L series, aimed at energy-efficient applications, combines a 128 MHz Arm Cortex-M33 processor with a low-power 2.4 GHz…
Deutsche Telekom pioneers eSIM transfers between Android and iOS
Deutsche Telekom has become the first European network operator, and among the first globally, to enable direct eSIM transfers between Android and iOS devices, a move that could simplify smartphone upgrades and platform switches for millions of users. The functionality,…
