The UK’s energy, logistics and manufacturing sectors could unlock billions in productivity gains and export opportunities from the next wave of global ‘Internet of Things’ (IoT) growth, but significant connectivity barriers remain in place, according to new research from UK…
Soracom launches commercial SGP.32 IoT eSIM platform for global device connectivity
Soracom has launched commercially available SGP.32-compatible IoT eSIMs and an accompanying orchestration platform, becoming one of the latest connectivity providers to bring the new GSMA remote SIM provisioning standard into general deployment. The company said its Connectivity Hypervisor service and…
Emesent secures $17 million to accelerate autonomous intelligence platform
Emesent, an autonomous mapping and robotics company, announced $17 million (USD) in total new funding to accelerate development of its Cortex AI autonomy platform, expand its Aura cloud software offering, and deepen its operations across the mining, defence, and architecture,…
Panasonic Industries enhances its PIR sensor portfolio
Panasonic Industry Europe announces the expansion of its proven PIR motion sensor portfolio with the introduction of PaPIRs+, the next evolution of its widely used PaPIRs technology. Designed to meet increasing demands in building automation and smart infrastructure, PaPIRs+ delivers…
Wi-SUN FAN becomes first wireless mesh network standard adopted by ISO/IEC
Wi-SUN Alliance announced that the Wi-SUN Field Area Network (FAN) specification has been formally ratified as ISO/IEC/IEEE 32857:2026. The designation makes Wi-SUN FAN the first wireless mesh networking specification adopted as an ISO/IEC standard and provides utilities, municipalities and infrastructure…
Ceva wins landmark AI licensing deal with Major U.S. Software and AI Platform Company
Ceva announced a landmark AI licensing deal with a major U.S. software and AI platform company for a custom AI silicon program targeting next-generation intelligent computing devices. The agreement extends Ceva’s customer base beyond traditional semiconductor companies and device OEMs…
Deal between 3PEAK and Anglia delivers cost effective drop-in analog parts
Anglia Components has signed a distribution deal with 3PEAK Incorporated, semiconductor company focusing on high-performance, high-quality, and highly reliable ICs, including signal chain, power management, and mixed-signal front-ends. Immediately attractive to UK and EU customers will be 3PEAK’s wide range…
Hrvatski Telekom unveils AI-first transformation, powered by Beyond Now
Beyond Now announced the next phase of its work with Hrvatski Telekom, Croatia’s communications services provider and part of Deutsche Telekom Group, as the operator advances its AI-first strategy to simplify B2B customer journeys, accelerate service delivery and bring new…
Inside Wialon’s Dakar challenge: a multi-layer fleet IoT deployment in the Saudi Arabian Desert
In the Saudi Arabian desert, Wialon transformed a Dakar-inspired off-road challenge into a live stress test for fleet IoT infrastructure. Darya Chumak, Head of Partner Success at Wialon, who took part in the challenge, explains how combining GSM, satellite telemetry,…
Open-standard SMARC form factor added to Digi ConnectCore 95 family
Digi International announced global availability of the Digi ConnectCore 95 SMARC system-on-module (SOM) development kit. Among the first to deliver a SMARC module as part of a complete, ready-to-deploy solution rather than as bare hardware, Digi ConnectCore 95 SMARC goes…
