SECO has announced its participation at embedded world China, taking place in Shanghai from 14 to 16 June.
The event offers an ideal platform for SECO to demonstrate its commitment to innovation in the embedded technology landscape through strategic cooperation with industry leaders like MediaTek. This collaboration has granted SECO early access to MediaTek’s Genio family of System-on-Chips (SoCs), enabling the development of two advanced System-on-Modules (SoM) – SOM-SMARC-Genio700 and SOM-SMARC-Genio510. These products allow customers to quickly incorporate the latest SoC technology from MediaTek, providing robust solutions that combine high performance, low power consumption, and broad connectivity options.
The MediaTek Genio series includes AI-capable chipset platforms that empower a wide range of IoT devices, from smart home appliances and industrial automation to connected healthcare. These power-efficient IoT SoCs combine multicore CPUs with enhanced GPU capabilities, dedicated AI processing units (APUs) for edge AI workloads, and robust connectivity. With the Genio series, performance reaches levels previously achievable only by processors with significantly higher power consumption. This advancement enables the creation of compact, passively cooled devices that do not compromise computing power.
The high-tier Genio 700 platform features an octa-core CPU and graphic engine, a multi-core AI processor supporting up to 4 TOPs, and advanced multimedia capabilities. Its efficient design facilitates Deep Learning, Neural Network acceleration, and Computer Vision applications. With slightly moderated processing performance, the Genio 510 SoC provides significant computing power at a competitive price, with a six-core CPU that excels in multitasking and responsiveness.
Driving IoT Innovation with MediaTek Genio Series
The SOM-SMARC-Genio700 and SOM-SMARC-Genio510 from SECO integrate these processors into compact, SMARC 2.1.1 standard modules designed for low-power industrial IoT applications requiring advanced connectivity, real-time processing, AI capabilities, and reduced power consumption. MediaTek’s dynamic resource allocation technology ensures optimal power efficiency when executing AI-driven applications and multimedia tasks. Dedicated AI processing units enable complex AI functions, while robust graphic capabilities allow for high-resolution, smooth visual displays. Support for the latest wireless standard, including Wi-Fi/BT options, ensures reliable and fast connectivity for IoT devices.
Equipped with 2x Arm Cortex-A78 cores and 6x Arm Cortex-A55 cores, the SOM-SMARC-Genio700 also features a Tensilica VP6 and a MediaTek APU3.0 AI processors delivering up to 4 TOPS. The integrated Mali-G57 MC3 GPU supports high-quality graphics and multiple display outputs via LVDS, eDP, HDMI, and DP interfaces. Up to 8 GB of soldered-down LPDDR4X-3733 RAM ensures smooth operation of demanding applications and workloads, providing robust performance even in environments with vibrations.
The SOM-SMARC-Genio510’s six-core CPU houses 2x Arm Cortex-A78 cores and 4x Arm Cortex-A55 cores, with an embedded AI engine delivering up to 2.8 TOPs. The Mali-G57 MC2 GPU supports 4K60 + FHD60 displays. Pin-to-pin compatibility with the Genio700 processor allows for easy performance upgrades without the need for redesign, accommodating greater workloads as required.
“SECO is thrilled to collaborate with MediaTek to bring cutting-edge innovations to the industrial IoT landscape. Our SOM-SMARC-Genio700 and SOM-SMARC-Genio510 modules leverage the advanced capabilities of MediaTek’s Genio series to offer unparalleled performance, efficiency, and connectivity. This collaboration embodies SECO’s commitment to delivering robust, low-power solutions that meet the evolving needs of our customers across various industries. By integrating MediaTek’s AI-capable SoCs, we empower our clients to manage new services with the possibility of processing data on the device and managing new interfaces based on 4K display and smooth interaction”, stated Maurizio Caporali, Chief Product Officer at SECO.
“Leveraging the AI-enabled MediaTek Genio 700 and Genio 510 chipsets, we are working closely with SECO on a wide array of embedded solutions,” said CK Wang, General Manager of the IoT business unit at MediaTek. “Through a combination of performance, power efficiency, and premium connectivity, our MediaTek Genio chips are aiding customers in developing products that are capable of enhancing the Industrial IoT landscape.”
Both modules offer various configurations to withstand diverse environmental conditions and meet heterogeneous needs, from mobile-connected applications to challenging industrial environments. They are also ready for integration with Clea and primed for use with SECO’s software suite. Clea enhances the hardware infrastructure with a series of value-added services encompassing device management, remote updates, and data pipeline management, all while ensuring top-tier security standards.
