At SPS – Smart Production Solutions 2023, the CC-Link Partner Association (CLPA) unveiled new products and services for developing safety devices with CC-Link IE TSN connectivity. This enhancement, backed by CLPA members Mitsubishi Electric and Neuron Automation, is set to…
Lockheed Martin prepares First 5G.MIL for orbit
Lockheed Martin is nearing a significant milestone in demonstrating the reach of its 5G.MIL capability across all domains globally. In a recent successful laboratory demonstration, Lockheed Martin confirmed that its innovative space payload is ready to provide advanced communications capabilities…
Canonical releases MicroCloud private Cloud
Canonical announced the general availability of MicroCloud, a low-touch, open source Cloud solution. MicroCloud is part of Canonical’s growing Cloud infrastructure portfolio. It is purpose-built for scalable clusters and edge deployments for all types of enterprises. It is designed with…
How innovation could drive decarbonisation in the built environment
In the race for net zero, the built environment needs to be a primary target for change. The OECD says that global emissions from buildings and construction account for 40% of global carbon emissions (and up to 70% in big…
6G-SANDBOX and ITRI sign MoU for 6G research
The Horizon Europe-funded 6G-SANDBOX project signed a memorandum of understanding (MoU) with the Industrial Technology Research Institute (ITRI) to foster collaboration between Europe and Taiwanese companies for 6G research. The collaboration will link 6G-SANDBOX testbeds with Taiwan’s vibrant telecommunications ecosystem…
Semiconductor Leadership Group urges UK Gov’t to include chip industry in Autumn Statement
The TechWorks Semiconductor Leadership Group (SLG), comprising executives from prominent UK semiconductor companies, in anticipation of the Chancellor’s forthcoming Autumn Statement, is advocating for HM Treasury to implement strategies that bolster the UK semiconductor manufacturing industry. This is crucial for…
Nordic Semiconductor is first silicon vendor to integrate Wi-Fi, IoT & Satellite tech
Nordic Semiconductor has introduced the nRF7000 Wi-Fi companion IC, claiming to be the first company to offer a complete silicon-to-Cloud locationing solution that includes Wi-Fi, cellular IoT, and GNSS. This offering, supported by Nordic’s technical support, is designed to simplify…
Eseye ranked ‘#1 Champion’ eSIM connectivity provider
Eseye announced that it has been named the #1 Champion for its eSIM Connectivity Solution by Kaleido Intelligence. This is the third consecutive year that Eseye has been awarded the Champion eSIM Connectivity Solutions in Kaleido’s annual Vendor Hub assessment,…
Securing 5G networks: addressing emerging security challenges
The advent of 5G technology marks a revolutionary step in connectivity, offering unparalleled speed, reliability, and scope for innovation. However, this transformative technology also introduces substantial security risks. As global dependence on 5G grows, prioritising its security is essential. 5G…
New Trio motion controller enables software integration for machine control and motion coordination
Trio Motion Technology has unveiled a novel motion controller, the PC-MCAT-2, at SPS. This controller integrates Intel multi-core processors and runs Microsoft Windows alongside Trio’s Advanced Motion-iX core, offering OEM machine builders a unified control solution that seamlessly merges Windows…
