Sony Semiconductor Israel announced the commercial release of its groundbreaking ALT1350 Wireless System on Chip (SoC). This advanced chipset, now available for sampling by partners and industry leaders including AM Telecom, Fibocom, Murata, Quectel, Semtech, Telit Cinterion, and Wistron NeWeb Corporation (WNC), is expected to enter mass production in the first half of 2024.
The ALT1350 is the inaugural cellular LTE-M/NB-IoT SoC integrating a low-power application MCU, sensor-hub for data collection and processing, enhanced security features, integrated SIM (iSIM), location technology, and an additional sub-GHz LPWA/FAN customisable transceiver with NTN communication options, all within a single chip. Offering cellular connected standby mode (eDRX) connectivity with power consumption below 3µA, the chipset’s overall power efficiency supports up to ten times longer battery life compared to its predecessors. Its comprehensive feature set renders it an exemplary solution for smart utility meters and single-chip asset tracking.
Promising unparalleled connectivity options, the ALT1350 caters to a wide array of industries and markets. In smart cities and utility sectors, it serves as a low-power cellular modem, mesh device, and router between cellular and mesh networks, alongside offering multiple connectivity backup options. Its extensive features and performance qualify it as an ideal choice for asset-tracking applications, providing multi-tier location services optimised for battery-operated devices.
Nohik Semel, CEO of Sony Semiconductor Israel, remarked: “The industry’s embrace of the ALT1350 SoC underscores the robust demand for new-generation LPWA technology solutions. This chipset not only supports applications across smart cities, logistics, connected health devices, and wearables but also heralds a new era of connectivity where battery longevity ceases to be a limitation. We are enthusiastic about collaborating with our partners to introduce this SoC to the market, facilitating the creation of innovative products.”
Jin Gyu Lee, CMO of AM Telecom, shared: “Developing our connectivity module and network device based on the ALT1350 chipset, in partnership with Sony, has been a remarkable journey. This provides us with a significant competitive advantage in LTE network coverage and cost-efficiency by integrating sub-GHz LPWA and LTE-M on a single SoC. We view this as a tremendous opportunity for leveraging small IoT devices powered by the ALT1350 chipset, which addresses challenges like battery life and WPS/GPS support, thereby revolutionising IoT communications.”
Kevin Guan, Director of MTC Product Marketing at Fibocom, stated: “We are excited to advance the 5G LPWA module solution in collaboration with Sony. With today’s announcement regarding the ALT1350’s commercial availability, we anticipate empowering various application fields in the near term. Fibocom’s 5G LPWA module MS180, incorporating the ALT1350, boasts an ultra-compact size and is engineered to offer ultra-low power consumption and reliable wireless connectivity for the 5G massive IoT market. We look forward to enabling industries such as smart metering, asset tracking, telematics, telehealth, smart city, and consumer electronics with our superior module solution.”
Hirokazu Nakae, General Manager of Connectivity Module Product Department at Murata, commented: “Partnering with Sony, a leader in cellular IoT connectivity, allows Murata to deliver unmatched feature integration, security, and system cost efficiency in the smallest possible form factor. Murata’s ALT1350 module is tailored to meet the specifications of vertical markets such as tracking, metering, wearables, and others. We aim to provide worldwide operator certificates, enabling customers to launch their products globally with a single design.”
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