Quectel Wireless Solutions has expanded its product line with the addition of three new short-range modules. These are the FC30R, a cost-efficient industrial-grade Wi-Fi module; the FCU743R, offering both Wi-Fi 4 and Bluetooth 5.2 capabilities; and the FCM740D, an MCU equipped with Wi-Fi 4 and Bluetooth 5.2. These modules are designed to help customers bring IoT devices to market more efficiently, reducing costs and shortening time to market.
“We’re constantly striving to provide our customers with the strongest possible portfolio across the Quectel product range,” said Norbert Muhrer, President and CSO, Quectel Wireless Solutions. “The inclusion of these modules expands the range of options in our short-range portfolio for customers’ IoT applications, empowering them to innovate in their IoT device designs and accelerate their time to market.”
The FC30R is a highly compact, industrial-grade Wi-Fi module that supports the IEEE 802.11 b/g/n standards. With dimensions of just 12.0mm × 12.0mm × 2.1mm, it is ideal for space-sensitive applications. This module integrates seamlessly with Quectel’s 5G and 4G modules, as well as various application processors, making it suitable for a wide array of M2M uses such as EV chargers, mobile hotspots, on-board diagnostics (OBD), gateways, and industrial PDAs.
The FCU743R is a high-performance module that supports Wi-Fi 4 and Bluetooth 5.2. It operates across the 2.4GHz and 5GHz bands, providing high-speed, low-power wireless transmission with a data rate of up to 150Mbps. Its compact size of 13.0mm × 12.2mm × 2.0mm makes it suitable for applications where space is a concern. Utilising surface-mount technology (SMT), the FCU743R is well-suited for rugged designs, and its low-profile LCC package ensures easy integration into space-constrained applications while offering reliable connectivity.
The FCM740D is a Wi-Fi 4 and Bluetooth 5.2 module with a built-in MCU. It features a high-performance processor running at up to 120MHz and supports the IEEE 802.11b/g/n protocol and Bluetooth Low Energy (BLE) 5.2. It comes with 256KB SRAM and either 2 MB or 4 MB of flash memory (depending on the option), and it complies with the WPA-PSK, WPA2-PSK, and WPA3-SAE security standards. Its compact LCC + DIP form factor (20.3 mm × 15.8mm × 2.7mm) optimises cost and size, making it a versatile option for smart home, industrial IoT, consumer electronics, and applications requiring high-temperature operation, such as HVAC systems, dimmers, and smart lighting.
Additionally, two MCU Bluetooth modules—the HCM511S and HCM010S—are now available in upgraded versions with enhanced transmission power and additional antenna options. The HCM511S-E offers 8 dBm transmit power and features an RF coaxial connector alongside an external pin antenna interface. The HCM010S-E now provides a pin antenna, RF coaxial connector, and an optional PCB antenna.
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