Congatec is set to unveil an array of new Computer-on-Modules at Embedded World (Hall 3, Booth 241). These innovations encompass modules powered by the latest Intel Core Ultra processors with built-in AI capabilities, alongside debuts of both low-power and high-performance x86 processor technologies. The focus of these presentations will be on delivering enhanced performance, improved energy efficiency, and advanced IIoT and security features, marking a first in the Computer-on-Module (COM) market. These advancements are poised to elevate the readiness of COMs for applications, fostering the development of modern, multifunctional, and fully connected embedded and IIoT devices, thereby setting Congatec apart from other market options.
“IIoT presents significant challenges for OEMs, challenges that we are addressing through an expanded functionality of our COM-HPC, COM Express, SMARC, and Qseven-based modules. By integrating hypervisor technology and IIoT capabilities directly into the modules, we simplify the process for solution providers to enhance their applications with increased functionalities, without the need for them to develop or integrate these technologies themselves. We will showcase the unique value we provide to OEM customers with these new functionalities at Embedded World,” said Tim Henrichs, Vice President of Marketing at Congatec.
OEMs’ embedded systems are now required to encompass a broader range of functionalities to fulfill the demands of digitalisation and IIoT connectivity. Congatec meets these heightened requirements with its proprietary hypervisor technologies and edge IoT functionalities, among others. The benefits of integrating this suite of solutions into the extended features of Computer-on-Modules will be demonstrated by Congatec for the first time at Embedded World.
The introduction of expanded IIoT capabilities for Computer-on-Modules reflects Congatec’s strategy of adding value: As a leading brand in the Computer-on-Modules market for embedded and edge computing globally, Congatec pioneers in offering extended functionalities and services for effortless integration of COM Express, COM-HPC, SMARC, and Qseven-based modules. Its comprehensive ecosystem includes sophisticated cooling solutions tailored to individual modules, carrier boards for simplified evaluation and application design, software support, and custom integration services. Additionally, Congatec’s testing and design services offer OEMs time and labour savings. This holistic approach eases module integration, enhances efficiency, and provides engineers with a high degree of design assurance. Customers gain from accelerated time-to-market, effectively navigating the rapid innovation cycles.
Congatec modules not only cover all functional aspects from processor and form factor capabilities but also set a new standard in application readiness for Computer-on-Modules, especially for real-time IIoT applications, through integrated virtualisation, digitalisation, and security features, offering comprehensive efficiency and convenience for OEMs.
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