At embedded world 2025, congatec announced two new key product developments, alongside its analysis of the current IoT landscape.
A special event during exciting IoT times
This year’s embedded world is a special one for the company, which celebrates its 20th year in the industry alongside its 20th visit to the event. Since then, the company has grown to become an international IoT powerhouse, offerings a wide array of solutions across various industries.
“The word IoT is no longer the buzzword that it once was, the market is now here for it,” said Dr. Dominik Ressing, CEO of congatec. The company foresees continuing growth in the industry, beyond its already popular upticks seen in recent years. The IoT market is expected to grow year-on-year at a CAGR of 12.8% across the industrial and medical IoT sectors.
congatec made two key announcements at this year’s embedded world, featuring its new conga-TC750 Computer-on-Module (COM) alongside new cooling solutions for COMs:
Meet the new conga-TC750
The conga-TC750 is a high-performance Computer-on-Module (COM) in the COM Express Compact Type 6 form factor, capable of delivering up to 99 TOPS AI performance. Powered by Intel Core Ultra Series 2 processors (Arrow Lake) with up to 16 cores and 22 threads, the module integrates Intel’s latest Xe-LPG+ graphics engine and an energy-efficient NPU. This combination enables significant performance gains for AI-driven applications in medical, robotics, industrial, retail, and gaming sectors. Developers using existing COM Express Compact platforms, such as the conga-TC700, can easily upgrade to this module, benefiting from improved x86 and AI capabilities with minimal development effort and a faster time-to-market.
The conga-TC750 supports up to 128GB DDR5 memory with in-band ECC, a 2.5GbE port with TSN, and extensive peripheral connectivity, including PCIe Gen4/5, USB4, SATA, and GPIOs. It also offers an optional NVMe x4 SSD for up to 1TB of storage. Designed for long-term availability of five years, the module is compatible with major operating systems, including Windows, Ubuntu, Linux, and Yocto. With Real-Time Systems’ integrated Hypervisor-on-Module, developers can consolidate multiple workloads, such as real-time control, AI, and IoT functions, on a single platform. Additionally, congatec provides an extensive ecosystem, including evaluation boards, cooling solutions, design-in services, and software building blocks for IIoT connectivity and cloud integration.
New products, new cooling solutions
congatec also unveiled its new acetone-based heat pipe cooling solution at embedded world 2025, designed to withstand extreme environmental conditions.
Unlike conventional heat pipes that use water, this solution prevents freezing at sub-zero temperatures, ensuring reliable operation in arctic and high-vibration environments. The cooling system is resistant to shock and mechanical stress, making it ideal for Computer-on-Module (COM) applications in industries such as logistics, rail, aviation, and autonomous vehicles. By eliminating the need for costly custom cooling solutions, this innovation allows developers to maintain system performance while reducing complexity and costs.
The acetone-based cooling solution is compatible with congatec’s COM Express Type 6 modules, such as the conga-TC675 and ultra-rugged conga-TC675r, as well as COM-HPC Mini, Client, and Server form factors. It ensures stable operation in temperature ranges from -40°C to +85°C, making it suitable for edge servers and other demanding applications. Available as a heat pipe adapter and other configurations upon request, this cooling solution reinforces congatec’s commitment to high-performance COM ecosystems, offering efficient heat dissipation alongside carrier boards and comprehensive development services.
