RANsemi, the Bristol-based wireless semiconductor company, has entered a partnership with India’s TechPhosis to develop an integrated small cell starter kit, in a move that aims to deepen UK–India collaboration in next-generation mobile infrastructure.
Announced today, the agreement brings together RANsemi’s expertise in Open RAN baseband technology and TechPhosis’ capabilities in 5G centralised and distributed unit software, and end-to-end Open RAN systems integration. The companies said the joint effort would accelerate development cycles for equipment makers exploring new integrated small-cell designs.
Mangal Singh, Co-Founder and Chief Operating Officer of TechPhosis, said the partnership would “enable a fast-track route for OEMs to accelerate integrated small-cell development, and strengthen the Open RAN ecosystem”. He added that the combined platform would offer a carrier-grade 5G solution built on a low-power system-on-chip, providing an “ultra-cost-optimised design with significantly reduced time-to-market”.
Peter Claydon, Chief Executive at RANsemi, said the two businesses were aligned in their aim of helping new entrants and innovators move more quickly in small-cell and Open RAN development. “By bringing together RANsemi’s PHY with TechPhosis’ Layer 2/3 expertise, we’re delivering a foundation that supports experimentation, rapid prototyping, and product realisation,” he said.
The collaboration is positioned as complementary to the UK–India Telecoms Security Initiative, which encourages cross-border research partnerships in network architecture and Open RAN security. The companies plan to combine RANsemi’s software-defined baseband PHY with TechPhosis’ upper-layer software to create a flexible development platform for 5G integrated small cells, targeting OEMs, system integrators, and research institutions.
The integrated small cell starter kit is expected to be available in Q1 2026, with expressions of interest already open via both companies’ websites.
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