Qualcomm has launched two processors aimed at bringing artificial intelligence, computer vision and connectivity to a wider range of connected devices, from smart appliances and retail systems to industrial controllers and machine vision equipment.
The Dragonwing Q-2390 and Dragonwing IQ-2390 were announced ahead of IFA 2026, with the company positioning the chips as lower-cost, highly integrated platforms for Edge computing.
The Q-2390 is the latest addition to Qualcomm’s Dragonwing Q2 Series and targets consumer, commercial and enterprise devices operating within tight power, size and cost constraints. The IQ-2390, meanwhile, is the first processor in a new IQ2 Series aimed at industrial applications.
Both platforms combine application processing, AI acceleration, graphics, connectivity and real-time processing in an effort to reduce the number of components required at the device level.
“The Dragonwing Q-2390 and IQ-2390 processors” are intended to help intelligence scale across applications including retail systems, smart appliances, consumer robots, industrial controllers and critical infrastructure, said Jeff Arnold, VP & GM, Auto Telematics & Industrial & Embedded IoT Consumer and Connectivity at Qualcomm Technologies.
The Q-2390 integrates a quad-core Qualcomm Kryo CPU, Adreno 704 GPU, real-time RISC-V microcontroller, camera and display support, LTE Cat 4, GPS and wired and wireless connectivity.
Qualcomm said the processor is intended for applications including point-of-sale terminals, kiosks, access control, smart appliances, agricultural equipment, home robots, fitness equipment and enterprise terminals.
The IQ-2390 is designed for what Qualcomm describes as the “far industrial edge”, where systems require real-time responsiveness and long operational lifecycles. Target applications include industrial automation, machine vision, building management, utilities and energy systems.
The processor combines AI and vision processing with dual Gigabit Ethernet and Time-Sensitive Networking (TSN), supporting applications such as human-machine interfaces, programmable logic controllers, gateways, industrial vision systems and energy management platforms.
The IQ-2390 is also designed to operate across an extended temperature range of -30°C to +115°C, with features intended to withstand vibration and shock in industrial environments.
Qualcomm is positioning the integration of processing, AI, connectivity and real-time control as a way for manufacturers to reduce bill of materials costs and board space, while simplifying the development of intelligent devices.
Both processors support Linux, Android and Zephyr OS. Qualcomm said the platforms are already being made available to customers through an early access programme, with system-on-module products from companies including Fibocom, SECO and Engicam.
Fibocom is developing an SC236 smart module based on the Q-2390, targeting applications including smart payment terminals and industrial handhelds. SECO is developing Compact Vision 5 and a single-board computer based on the IQ-2390, while Engicam is developing a system-on-module for industrial applications.
The new Dragonwing platforms will be demonstrated at IFA 2026, with evaluation kits for both processors expected to become available in early 2027.
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