Silicon Labs recently unveiled the first products of its Series 3 portfolio with the introduction of two new wireless SoC families built at the advanced 22 nanometer (nm) process node: the SiXG301 and SiXG302. These highly integrated solutions represent a notable leap forward in compute power, integration, security, and energy efficiency, addressing the growing demands of both line-powered and battery-powered IoT devices.
As smart devices grow more sophisticated and compact, the need for powerful, secure, and highly integrated wireless solutions has never been more important. The new Series 3 SoCs deliver on this promise with advanced processing capabilities, flexible memory options, best-in-class security, and streamlined external component integration. Silicon Labs’ Series 1, Series 2, and Series 3 platforms will continue to complement one another in the market and address the full breadth of IoT applications.
The new Series 3 families of SoCs include:
- SiXG301: optimised for line-powered applications
Purpose-built for line-powered smart devices, the SiXG301 includes an integrated LED pre-driver and offers a well suited solution for advanced LED lighting and smart home products, supporting Bluetooth, Zigbee, and Thread with support for Matter. Built with high Flash and RAM overhead of 4MB and 512kB, respectively, the SiXG301 helps to future-proof customer designs as the requirements for Matter and other more demanding IoT applications continue to grow. This SoC facilitates concurrent multi-protocol operation for Zigbee, Bluetooth and Matter over Thread networks at the same time, which helps simplify manufacturing SKUs, reduce costs, save board space for additional device integrations, and improve consumer usability. Already in production with select customers, the SiXG301 is slated for general availability in Q3 2025. - SiXG302: designed for battery-powered efficiency
Expanding Series 3 to battery-powered applications, the upcoming SiXG302 will deliver energy efficiency without sacrificing performance. Featuring Silicon Labs’ advanced power architecture, the SiXG302 is designed to use only 15 µA/MHz active current, 30% lower than competitive devices in its class. This makes it well suited for battery-powered wireless sensors and actuators for both Matter and Bluetooth applications. The SiXG302 is planned for customer sampling in 2026.
“Smart devices are becoming more complex, and designers are challenged to pack greater functionality into smaller spaces while maintaining energy efficiency,” said Ross Sabolcik, Senior Vice President of Product Lines, Silicon Labs. “With the SiXG301 and upcoming SiXG302 families, we’re delivering flexible, highly integrated solutions that enable next-generation IoT devices—whether they’re plugged in or running on battery power.”
The SiXG301 and SiXG302 families will initially include ‘M’ devices for multiprotocol, the SiMG301 and SiMG302, and ‘B’ devices optimised for Bluetooth LE communications, the SiBG301 and SiBG302.
By harnessing the 22nm process node for all Series 3 devices, Silicon Labs is addressing growing demand for more powerful and efficient far-edge devices across a wide range of IoT applications—from smart cities and industrial automation to healthcare, smart homes, and beyond.
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