RAIN Alliance has announced the publication of its RAIN Manufacturing Quality Guideline. This document addresses the pressing need for an open, transparent, and scalable framework for RAIN tag quality assurance and validation, providing an essential building block for manufacturers to…
Search Results For: CES 2024
Kigen receives investment from SBI Group
Kigen has received a strategic investment from the SBI Group, one of Japan’s largest financial services and investment groups. This latest investment joins existing backers Arm Holdings and SoftBank Vision Fund 2, marking a significant milestone in Kigen’s mission to make cellular technology more…
New upgrades to Telenor IoT test lab
Telenor IoT has announced a significant upgrade to its advanced test lab in Karlskrona. With new features and equipment, the lab strengthens its position as a central resource for ensuring optimised IoT solutions for customers worldwide. “Our test lab is…
VIAVI and Hanyang University will work together on 6G research
VIAVI Solutions (VIAVI) and Hanyang University, one of South Korea’s leading academic institutions, have announced a Memorandum of Understanding (MoU) to collaborate on AI-RAN, 5G and 6G research at the university’s Beyond-G Global Innovation Center. VIAVI will contribute wireless lab…
Soracom talks about democratising IoT and AI application building
The launch of Soracom Flux in July 2024 was showcased at the latest iteration of Hardware Pioneers; a low-code application builder that enables non-technical users to build AI-integrated IoT applications in real-time. Takashi Serizawa, Head of Europe Region at Soracom…
Cubic3 and SoftBank to integrate NTN into SDVs
Cubic3 and SoftBank have announced a strategic partnership to advance the integration of satellite-based non-terrestrial networks (NTN) with terrestrial networks (TN) to create a ‘Ubiquitous Network’ for software-defined vehicles (SDVs) and other high-value mobile assets. This collaboration builds on the…
First module of ST and Qualcomm collaboration begins production
STMicroelectronics has announced mass-production start for its ST67W611M1 combined Wi-Fi 6 and Bluetooth Low Energy 5.4 module. The module marks the first product of ST’s collaboration with Qualcomm Technologies, which was announced by the two companies in 2024, to simplify…
Silicon Labs and Wirepas celebrate shipping 10m wireless SoCs
Silicon Labs and Wirepas have celebrated a milestone: they have shipped 10 million wireless SoCs running Wirepas’ RF mesh connectivity software, primarily in the Indian market with the Silicon Labs sub-GHz FG23 SoC. These chips power some of the world’s…
VIAVI Solutions talks to IoT Insider about the tech on the horizon
In covering all aspects of a telecom network and being around for 102 years, VIAVI Solutions is in a good position to understand not only the needs of its customers, but where the market is headed. IoT Insider spoke to…
Vodafone-Three merger finally completed
The Vodafone-Three merger has officially been completed as both companies celebrated the end of a journey that began in June 2023, when the merger was first proposed. The initial proposal was met with concern about reduced competitiveness in the UK,…