The COMeT6-1100 Com Express type six compact CPU module uses the 11th-generation Intel Core i3, i5 and i7 processors for industrial, IoT and embedded systems. With RAM soldered down, it handles applications running in environments subject to shock, vibration and extended temperatures.
“We have seen strong acceptance of our type ten Com Express modules in this accelerating market along with continuing concerns about data and device security and speed to market,” said Winsystems chief revenue officer Robert Dunaway. “These issues have only increased demand for highly reliable Com modules that are designed, manufactured and supported within the USA. We are driven to anticipate and fulfil customers’ needs for upgrade paths that maximise long-term availability and minimise supply chain risks.”
The module suits such critical applications as industrial automation and controls, robotics, and digital surveillance and signage. It can also be used in IoT devices for energy and transportation management, military, commercial-off-the-shelf (COTS), scientific analysis and medical diagnostics.
It delivers up to 32Gbyte LPDDR4 4226MT/s of fast system memory. Hardware security is addressed through an onboard discrete TPM 2.0 device for root-of-trust authentication.
Operating temperature spans -40 to +85˚C and it is CE compliant. Onboard eMMC 5.x storage options extend from 8 to 128Gbyte, while the module’s soldered-down LPDDR4 RAM protects shock- and vibration-sensitive applications.
The module supports up to four independent video displays and expansion options. Three digital display interfaces can be converted to DisplayPort++, HDMI or DVI on the carrier, and one embedded DisplayPort (eDP) LCD interface can be optionally populated with a single-channel LVDS output.
Connectivity is addressed through five configurable PCIe lanes, four USB 3.2 gen-one and eight USB 2.0 channels along with one i226 2.5Gbit/s Ethernet RGMII. HD audio signals and two Sata 3.0 interfaces for storage are also available.
The module is compatible with any carrier board conforming to the Picmg Com Express type-six standards. It can also be paired with Winsystems’ recently launched Com Express type-six development carrier board, aiding in rapid prototyping and reducing time to market.
By developing and manufacturing its own computer-on-module products at its facility in Grand Prairie, Texas, Winsystems maintains control over all components and its build quality.
“Equally important at Winsystems, we back these rugged embedded solutions with top-notch technical support, BIOS customisation services and timely delivery, so our customers get to market faster,” Dunaway said. “Our application engineers are ready to address requests for information and provide design consultations to help customers take advantage of our expanding Com Express capabilities.”
There’s plenty of other editorial on our sister site, Electronic Specifier! Or you can always join in the conversation by commenting below or visiting our LinkedIn page.
