Taoglas, the San Diego-based RF components specialist, has expanded its line-up of low-cost ceramic chip antennas aimed at manufacturers of next-generation connected devices, introducing three models designed for Wi-Fi 6/7, UWB, and ISM-band applications.
The ILA.257, ILA.68, and ILA.89 antennas, unveiled this week, use low temperature co-fired ceramic technology to deliver high radiation efficiency and stable performance in increasingly compact device layouts. Taoglas said the new components require less keep-out area than rival products, a constraint that has become more pressing as designers integrate multiple radios into ever smaller consumer, industrial, and wearable hardware.
The flagship ILA.257 targets tri-band Wi-Fi 6 and Wi-Fi 7 devices operating across the 2.4 GHz, 5.8 GHz, and 7.125 GHz bands, including the extended 6 GHz spectrum used by Wi-Fi 6E. Measuring 3.2 × 1.6 × 0.5 mm, it is positioned for use in wearables, compact IoT modules, and portable electronics, where maintaining signal integrity at higher frequencies is often difficult.
The ILA.68, designed for UWB systems operating between 6 GHz and 8.5 GHz, offers what the company describes as a stable, omnidirectional radiation pattern and low insertion loss across temperature swings. Taoglas expects demand from applications such as indoor positioning, secure access systems, automotive sensing, and small-form-factor smart home devices.
For long-range, low-power applications, the ILA.89 supports the 868 MHz and 915 MHz ISM bands used in LPWAN and LoRa technologies. With a footprint of 4.0 × 12.0 × 1.6 mm, it offers radiation efficiency of up to 47.9%, and is aimed at battery-powered industrial and consumer devices designed for deployment across both European and US markets.
Baha Badran, Head of Engineering at Taoglas, said increasing device miniaturisation continued to complicate RF design. He added that the new LTCC range was intended to simplify integration “without compromising efficiency or reliability”, enabling engineers to maintain performance while reducing footprint.
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