The newly launched small and cost-effective PAN B511-1C Bluetooth module from Panasonic Industry brings great performance and memory while minimising current power consumption, based on the Nordic nRF54L15 single chip controller.
A dedicated number of GPIOs is positioned at the edge of the module, with the rest of the GPIOs located at the bottom pad. In total, the module provides access to all 32 GPIOs of the chip. Despite its hybrid packaging of castellated holes and LGA, the module remains at the small size of a two cent coin. This way, it brings together the advantages of both worlds without compromising on size and enables one of the best pin-to-size ratios for Bluetooth modules currently on the market. Its edge pins facilitate easier hand-soldering and support the use of inexpensive 2-layer PCB designs and optical inspection methods, eliminating the need for costly X-ray machines.
The module also features an embedded microcontroller and ARM Cortex- M33 with a high amount of flash memory of 1.5MB and a RAM size of 256kB.
“Our latest PAN B511-1C Bluetooth module features very complex and sophisticated algorithms,” said Tomsilav Tipura, Product Manager, Panasonic Industry. “We also offer three different spec variants to enable a variety of applications. The modules are for example available with additional integrated slow clock crystal for energy efficient battery powered operation and additional 4MB Flash Memory for more complex applications. We think our clients will love this module for its versatility and power at a competitive price point.”
An output power of 8dbm makes the module well suited for the European market. The key applications are lighting, home appliances, industrial sensors, medical devices, healthcare wearables and energy management devices and solar farms. The PAN B511-1C is also well suited for Matter applications, as it comes equipped with additional flash memory and is fully compatible with the PAN MAX Service that facilitates the production and launch of Matter production. The module will be available in three distinct spec variants to cater to diverse project needs.
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