Morse Micro has launched the seccond generation of its MM8108 Wi-Fi HaLow System-on-Chip (SoC), building on the success of the first generation MM6108 SoC, while offering even better performance in all key areas of range, throughput, and power efficiency and reducing the cost, effort, and time to bring the next generation of Wi-Fi HaLow enabled products to market.
The MM8108 delivers data rates of up to 43.33Mbps using world-first sub-GHz 256-QAM modulation at an 8MHz bandwidth, making it well-suited for a range of applications in agricultural, mining, industrial, home, and city environments. Its integrated 26dBm power amplifier (PA) with exceptional power efficiency, and low-noise amplifier (LNA) ensure exceptional performance and enable global regulatory certification without the need for external Surface Acoustic Wave (SAW) filters. The power efficiency significantly extends battery life and enables the uptake of solar-powered Wi-Fi HaLow connected cameras and IoT devices.
“Once again, our engineering team has focused on creating the smallest, fastest and lowest power Wi-Fi HaLow chip in the market,” commented Andrew Terry, Co-Founder and CTO of Morse Micro. “The MM8108 enables powerful and practical solutions for the evolving demands of IoT. With features like host offloading, integrated amplifiers, and industry-leading security, the MM8108 makes developing long-range, low-power IoT applications more simple and cost-effective than ever before.”
The key features of the new solution include:
- World-first 256-QAM (MCS9) operation: Improved spectrum efficiency, minimizing interference in high-density environments and enabling throughputs of up to 43.33Mbps
- USB, SDIO and SPI host integration: Improving ease of integration and enabling USB AP and STA dongle operation on new and existing network infrastructure
- Integrated PA with unmatched transmit efficiency: High transmit output power of 26dBm with only 325mA current draw from a 3.3V voltage source
- Low power operation: Optimised for battery-operated applications with significantly extended sleep times and ultra-low power consumption in sleep modes
- Class-leading Rx and Tx performance: Longest reach and fastest Wi-Fi HaLow chip in the market, enabling countless applications including AI-enabled IoT devices and streaming multiple Ultra High Definition (HD) 4K cameras in real-time over extensive range
- Enhanced security: Supports next-generation WPA3 with Simultaneous Authentication of Equals (SAE) and GCMP encryption for robust link-layer protection
- Scalable design: Compact 5 x 5 mm BGA package minimises printed circuit board (PCB) size and cost
Morse Micro is also launching the MM8108-RD09 USB dongle reference design alongside its SoC, demonstrating the ease of upgrading new and existing Wi-Fi 4/5/6/6E/7 network infrastructure to support Wi-Fi HaLow. The dongle reference design will be made available to customers as a fully-compliant Wi-Fi HaLow reference design.
Additionally, the MM8108-RD09 USB dongle will be bundled with Raspberry Pi 4B, power supply and antenna, and made available as a complete Wi-Fi HaLow evaluation kit (the MM8108-EKH19) targeting customers who are interested in testing and integrating the MM8108 within their platforms. This strong combination puts the MM8108 at the centre of a ready-to-deploy, compact solution that robustly integrates Wi-Fi HaLow connectivity into existing devices with exceptional ease and efficiency.
“The MM8108-EKH19 is more than just a Wi-Fi HaLow evaluation platform – it’s an enabler of market transformation,” said Michael De Nil, Co-Founder and CEO of Morse Micro. “By simplifying the integration process, we’re making it easier for customers to adopt Wi-Fi HaLow, driving growth and opening doors to new opportunities in IoT and beyond. These solutions position Morse Micro as a leader in a rapidly expanding market, empowering businesses to leverage the full potential of Wi-Fi HaLow for transformative connectivity.”
There’s plenty of other editorial on our sister site, Electronic Specifier! Or you can always join in the conversation by commenting below or visiting our LinkedIn page.
