Mouser Electronics is now shipping the Ensemble microcontroller and processor family from Alif Semiconductor. The Ensemble series creates a scalable and compatible continuum of integrated embedded processors for low-end to high-end intelligent IoT end-point devices in applications such as automotive,…
Sequans and Soracom offer new evaluation kits
Sequans and Soracom announced an expansion of their partnership, where both companies aim to simplify the development of IoT projects by offering evaluation kits (EVKs) powered by Soracom’s global IoT connectivity. IoT application developers now have access to Sequans‘ LTE-M/NB-IoT…
Consult Red and Thundercomm partner to harness power of IoT
Consult Red, a technology consultancy and professional services provider, has partnered with Thundercomm, an IoT solutions provider powered by Qualcomm Technologies. This partnership will combine Consult Red’s consultancy and expert development services with Thundercomm’s IoT solutions, allowing customerrs to adopt…
Samsung picks Anritsu wireless test set for S25 production
Anritsu is pleased to announce that Samsung Electronics has chosen the Anritsu Universal Wireless Test Set MT8870A for use on mass-production lines of the Galaxy S25, Samsung Electronics’ next-gen smartphone that is compatible with the non-terrestrial networks (NTN) NB-IoT standard.…
ENIGMA to acquire Dellfer, expanding Zero Trust platform
Option3 announced that ENIGMA has agreed to acquire Dellfer, a firmware security company serving the automotive and IoT markets. The transaction comes months after ENIGMA’s acquisition of Onclave Networks in August 2024 and represents a significant expansion of the platform’s…
Semtech module certified by three US carriers
Semtech announced the certification of the HL7900 Global 5G LPWA module by three US carriers – AT&T, T-Mobile, and Verizon – alongside KDDI in Japan. It has also achieved global regulatory certifications including FCC (US), ISED (Canada), CE (Europe), JRF/JPA…
DigiCert announces new hires
DigiCert has appointed Paul Holt as EMEA Group Vice President and James Cook as APAC Group Vice President, with these new appointments reflecting the company’s commitment to meeting growing demand for digital trust and resilience in these high-growth regions. Holt…
PCBWay’s success with 24-Layer, 6-Order HDI PCB
With the continuous development of the integrated circuit industry, the connections between chips have become increasingly complex. Traditional PCB technology faces limitations in applications with higher frequency and speed requirements. Achieving stable and reliable connections between high-speed and high-density chips…