Myriota has announced the expansion of its connectivity portfolio with the launch of Myriota HyperPulse, a 3GPP 5G-based Narrowband Non-Terrestrial Network (NB-NTN) service built together with Viasat. Myriota HyperPulse is the first solution of its kind powered by Viasat’s dynamic…
Silicon Labs releases SoC for Matter standard
Silicon Labs has announced that its MG26 family of wireless SoCs is now available through the company and its distribution partners. As one of the most advanced high-performance matter and concurrent multiprotocol solution, the MG26 SoC features double the Flash…
Arm drives Edge AI forward with new platform
Arm has introduced its Armv9 Edge AI platform, featuring the new Arm Cortex-A320 CPU and the AI accelerator for Edge AI, Arm Ethos-U85 NPU, enabling AI models of over one billion parameters to run on device. OEMs are under greater…
KPN IoT launches latest eSIM solution
KPN IoT announced the launch of its eSIM technology, which is compliant with the latest eSIM IoT specification, the SGP.32 standard. The solution, which was developed in partnership with IDEMIA Secure Transactions, strengthens KPN IoT’s commitment in delivering the best…
Spirent and CEWiT to support India’s Bharat 6G Vision
Spirent Communications announced its collaboration with the Centre of Excellence in Wireless Technology (CEWiT) to support the Indian government’s ‘Bharat 6G Vision’ wherein it aims to position India as a leader in 6G technology. CEWiT is an autonomous research society…
VIAVI to underpin importance of telecoms ecosystem at MWC
VIAVI Solutions is set to showcase advances underpinning key shifts in the telecom industry with over 20 companies at MWC from 3-6 March. Demonstrations at the event will reinforce the importance of the telecom ecosystem and industry collaboration as communication…
MediaTek will launch cellular modem at MWC 2025
At MWC in Barcelona MediaTek is launching the M90 5G-advanced cellular modem solution, aligning with 3GPP Release 17 and the upcoming Release 18 specifications. The MediaTek M90 delivers high downlink performance of up to 12Gbps and boosts uplink performance by…
e-peas and Silicon Labs demonstrate ambient IoT system
Last week e-peas teamed up with Silicon Labs in a first reveal of e-peas’ and Silabs’ new Explorer Kit. In the video, both companies showcased how smart building, asset tracking and factory automation device OEMs can simply and cost effectively…
Rutronik extends base board for energy harvesting
The growing demand for IoT devices coupled with a demand for energy-efficient energy harvesting modules has led Rutronik to focus on innovative solutions for harvesting energy from the surrounding environment. Rutronik’s System Solution developers and wireless application experts are introducing…
52.8bn RAIN chips shipped in 2024
RAIN Alliance announced that 52.8bn RAIN tag chips/ICs were shipped globally in 2024, as reported by five of its tag manufacturer members; EM Microelectronic, Impinj, NXP, Shanghai Fudan Microelectronics Group and Shanghai Quanray Electronics. RAIN technology connects everyday items to…
